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| 1. general description the PCA9670 provides general purpose remote i/o expansion for most microcontroller families via the two-line bidirectional bus (i 2 c-bus) and is a part of the fast-mode plus family. the PCA9670 is a drop-in upgrade for the pcf8574 providing higher fast-mode plus (fm+) i 2 c-bus speeds (1 mhz versus 400 khz) so that the output can support pwm dimming of leds, higher i 2 c-bus drive (30 ma versus 3 ma) so that many more devices can be on the bus without the need for bus buffers, higher total package sink capacity (200 ma versus 100 ma) that supports having all 25 ma leds on at the same time and more device addresses (64 versus 8) are available to allow many more devices on the bus without address con?icts. the difference between the PCA9670 and the pcf8574 is that the interrupt output on the pcf8574 is replaced by a reset input on the PCA9670. the devices consist of an 8-bit quasi-bidirectional port and an i 2 c-bus interface. the PCA9670 have low current consumption and include latched outputs with 25 ma high current drive capability for directly driving leds. the internal power-on reset (por), hardware reset pin ( reset), or software reset sequence initializes the i/os as inputs. 2. features n 1 mhz i 2 c-bus interface n compliant with the i 2 c-bus fast and standard modes n sda with 30 ma sink capability for 4000 pf buses n 2.3 v to 5.5 v operation with 5.5 v tolerant i/os n 8-bit remote i/o pins that default to inputs at power-up n latched outputs with 25 ma sink capability for directly driving leds n total package sink capability of 200 ma n active low reset input n 64 programmable slave addresses using 3 address pins n readable device id (manufacturer, device type, and revision) n low standby current n - 40 c to +85 c operation n esd protection exceeds 2000 v hbm per jesd22-a114, 200 v mm per jesd22-a115, and 1000 v cdm per jesd22-c101 n latch-up testing is done to jedec standard jesd78 which exceeds 100 ma n packages offered: so16, tssop16, hvqfn16 PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset rev. 01 20 june 2006 objective data sheet
PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 2 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 3. applications n led signs and displays n servers n industrial control n medical equipment n plcs n cellular telephones n gaming machines n instrumentation and test measurement 4. ordering information 5. block diagram table 1. ordering information type number topside mark package name description version PCA9670bs 9670 hvqfn16 plastic thermal enhanced very thin quad ?at package; no leads; 16 terminals; body 3 3 0.85 mm sot758-1 PCA9670d PCA9670d so16 plastic small outline package; 16 leads; body width 7.5 mm sot162-1 PCA9670pw 9670 tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 fig 1. block diagram of PCA9670 002aac256 reset i 2 c-bus control PCA9670 ad0 ad1 ad2 input filter shift register sda scl 8 bits write pulse read pulse power-on reset v dd v ss i/o port p0 to p7 PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 3 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 6. pinning information 6.1 pinning fig 2. simpli?ed schematic diagram of p0 to p7 002aac109 write pulse read pulse d ci s ff q power-on reset data from shift register i trt(pu) 100 m a i oh i ol v dd p0 to p7 v ss d ci s ff q data to shift register to interrupt logic fig 3. pin con?guration for so16 fig 4. pin con?guration for tssop16 fig 5. pin con?guration for hvqfn16 PCA9670d ad0 v dd ad1 sda ad2 scl p0 reset p1 p7 p2 p6 p3 p5 v ss p4 002aac257 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 PCA9670pw ad0 v dd ad1 sda ad2 scl p0 reset p1 p7 p2 p6 p3 p5 v ss p4 002aac258 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 transparent top view 4 9 3 10 2 11 1 12 5 6 7 8 16 15 14 13 terminal 1 index area 002aac261 PCA9670bs p2 p6 p1 p7 p0 reset ad2 scl p3 v ss p4 p5 ad1 ad0 v dd sda PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 4 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 6.2 pin description [1] hvqfn package die supply ground is connected to both the v ss pin and the exposed center pad. the v ss pin must be connected to supply ground for proper device operation. for enhanced thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias need to be incorporated in the pcb in the thermal pad region. table 2. pin description symbol pin description so16, tssop16 hvqfn16 ad0 1 15 address input 0 ad1 2 16 address input 1 ad2 3 1 address input 2 p0 4 2 quasi-bidirectional i/o 0 p1 5 3 quasi-bidirectional i/o 1 p2 6 4 quasi-bidirectional i/o 2 p3 7 5 quasi-bidirectional i/o 3 v ss 86 [1] supply ground p4 9 7 quasi-bidirectional i/o 4 p5 10 8 quasi-bidirectional i/o 5 p6 11 9 quasi-bidirectional i/o 6 p7 12 10 quasi-bidirectional i/o 7 reset 13 11 reset input (active low) scl 14 12 serial clock line sda 15 13 serial data line v dd 16 14 supply voltage PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 5 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 7. functional description refer to figure 1 bloc k diag r am of PCA9670 . 7.1 device address following a start condition, the bus master must send the address of the slave it is accessing and the operation it wants to perform (read or write). the address of the PCA9670 is shown in figure 6 . slave address pins ad2, ad1, and ad0 choose 1 of 64 slave addresses. to conserve power, no internal pull-up resistors are incorporated on ad2, ad1, and ad0. address values depending on ad2, ad1, and ad0 can be found in t ab le 3 PCA9670 address map . remark: when using the PCA9670, reserved i 2 c-bus addresses must be used with caution since they can interfere with: ? reserved for future use i 2 c-bus addresses (0000 011, 1111 101, 1111 110, 1111 111) ? slave devices that use the 10-bit addressing scheme (1111 0xx) ? high speed mode (hs-mode) master code (0000 1xx) the last bit of the ?rst byte de?nes the operation to be performed. when set to logic 1 a read is selected, while a logic 0 selects a write operation. when ad2, ad1 and ad0 are held to v dd or v ss , the same address as the pcf8574 is applied. fig 6. PCA9670 address r/w 002aab636 a6 a5 a4 a3 a2 a1 a0 programmable slave address PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 6 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 7.1.1 address maps table 3. PCA9670 address map ad2 ad1 ad0 a6 a5 a4 a3 a2 a1 a0 address v ss scl v ss 001000020h v ss scl v dd 001000122h v ss sda v ss 001001024h v ss sda v dd 001001126h v dd scl v ss 001010028h v dd scl v dd 00101012ah v dd sda v ss 00101102ch v dd sda v dd 00101112eh v ss sclscl001100030h v ss sclsda001100132h v ss sdascl001101034h v ss sdasda001101136h v dd sclscl001110038h v dd sclsda00111013ah v dd sdascl00111103ch v dd sdasda00111113eh v ss v ss v ss 010000040h v ss v ss v dd 010000142h v ss v dd v ss 010001044h v ss v dd v dd 010001146h v dd v ss v ss 010010048h v dd v ss v dd 01001014ah v dd v dd v ss 01001104ch v dd v dd v dd 01001114eh v ss v ss scl010100050h v ss v ss sda010100152h v ss v dd scl010101054h v ss v dd sda010101156h v dd v ss scl010110058h v dd v ss sda01011015ah v dd v dd scl01011105ch v dd v dd sda01011115eh PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 7 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset scl scl v ss 1010000a0h scl scl v dd 1010001a2h scl sda v ss 1010010a4h scl sda v dd 1010011a6h sda scl v ss 1010100a8h sda scl v dd 1010101aah sda sda v ss 1010110ach sda sda v dd 1010111aeh sclsclscl1011000b0h sclsclsda1011001b2h sclsdascl1011010b4h sclsdasda1011011b6h sdasclscl1011100b8h sdasclsda1011101bah sdasdascl1011110bch sdasdasda1011111beh scl v ss v ss 1100000c0h scl v ss v dd 1100001c2h scl v dd v ss 1100010c4h scl v dd v dd 1100011c6h sda v ss v ss 1100100c8h sda v ss v dd 1100101cah sda v dd v ss 1100110cch sda v dd v dd 1100111ceh scl v ss scl1110000e0h scl v ss sda1110001e2h scl v dd scl1110010e4h scl v dd sda1110011e6h sda v ss scl1110100e8h sda v ss sda1110101eah sda v dd scl1110110ech sda v dd sda1110111eeh table 3. PCA9670 address map continued ad2 ad1 ad0 a6 a5 a4 a3 a2 a1 a0 address PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 8 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 7.2 software reset call, and device id addresses two other different addresses can be sent to the PCA9670. ? general call address: allows to reset the PCA9670 through the i 2 c-bus upon reception of the right i 2 c-bus sequence. see section 7.2.1 softw are reset for more information. ? device id address: allows to read id information from the device (manufacturer, part identi?cation, revision). see section 7.2.2 de vice id (PCA9670 id ? eld) for more information. 7.2.1 software reset the software reset call allows all the devices in the i 2 c-bus to be reset to the power-up state value through a speci?c formatted i 2 c-bus command. to be performed correctly, it implies that the i 2 c-bus is functional and that there is no device hanging the bus. the software reset sequence is de?ned as following: 1. a start command is sent by the i 2 c-bus master. 2. the reserved general call i 2 c-bus address 0000 000 with the r/ w bit set to 0 (write) is sent by the i 2 c-bus master. 3. the PCA9670 device(s) acknowledge(s) after seeing the general call address 0000 0000 (00h) only. if the r/ w bit is set to 1 (read), no acknowledge is returned to the i 2 c-bus master. 4. once the general call address has been sent and acknowledged, the master sends 1 byte. the value of the byte must be equal to 06h. a. the PCA9670 acknowledges this value only. if the byte is not equal to 06h, the PCA9670 does not acknowledge it. if more than 1 byte of data is sent, the PCA9670 does not acknowledge any more. 5. once the right byte has been sent and correctly acknowledged, the master sends a stop command to end the software reset sequence: the PCA9670 then resets to the default value (power-up value) and is ready to be addressed again within the speci?ed bus free time. if the master sends a repeated start instead, no reset is performed. fig 7. general call address fig 8. device id address 0 002aac115 0 0 0 0 0 0 0 r/w r/w 002aac116 1 1 1 1 1 0 0 PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 9 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset the i 2 c-bus master must interpret a non-acknowledge from the PCA9670 (at any time) as a software reset abort. the PCA9670 does not initiate a reset of its registers. the unique sequence that initiates a software reset is described in figure 9 . 7.2.2 device id (PCA9670 id ?eld) the device id ?eld is a 3-byte read-only (24 bits) word giving the following information: ? 8 bits with the manufacturer name, unique per manufacturer (for example, philips). ? 13 bits with the part identi?cation, assigned by manufacturer, the 7 msbs with the category id and the 6 lsbs with the feature id (for example, for example PCA9670 16-bit quasi-output i/o expander). ? 3 bits with the die revision, assigned by manufacturer (for example, rev x). the device id is read-only, hardwired in the device and can be accessed as follows: 1. start command 2. the master sends the reserved device id i 2 c-bus address 1111 100 with the r/ w bit set to 0 (write). 3. the master sends the i 2 c-bus slave address of the slave device it needs to identify. the lsb is a dont care value. only one device must acknowledge this byte (the one that has the i 2 c-bus slave address). 4. the master sends a re-start command. remark: a stop command followed by a start command will reset the slave state machine and the device id read cannot be performed. remark: a stop command or a re-start command followed by an access to another slave device will reset the slave state machine and the device id read cannot be performed. 5. the master sends the reserved device id i 2 c-bus address 1111 100 with the r/ w bit set to 1 (read). 6. the device id read can be done, starting with the 8 manufacturer bits (?rst byte + 4 msb of the second byte), followed by the 13 part identi?cation bits and then the 3 die revision bits (3 lsb of the third byte). 7. the master ends the reading sequence by nacking the last byte, thus resetting the slave device state machine and allowing the master to send the stop command. remark: the reading of the device id can be stopped anytime by sending a nack command. fig 9. software reset sequence 002aac263 0 0 0 0 0 0 0 a s 0 swrst call i 2 c-bus address start condition r/w acknowledge from slave(s) 0 0 0 0 1 1 0 0 swrst data = 06h a acknowledge from slave(s) p PCA9670 is(are) reset. registers are set to default power-up values. PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 10 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset remark: if the master continues to ack the bytes after the third byte, the PCA9670 rolls back to the ?rst byte and keeps sending the device id sequence until a nack has been detected. for the PCA9670, the device id is as shown in figure 10 . fig 10. PCA9670 id if more than 2 bytes are read, the slave device loops back to the ?rst byte (manufacturer byte) and keeps sending data until the master generates a no acknowledge. fig 11. device id ?eld reading 0 002aac264 0 0 revision 1 0 1 0 1 0 0 1 0 part identification 0 0 0 0 0 0 0 0 0 0 0 0 manufacturer category identification feature identification 002aac267 1 1 1 1 0 0 0 a s 1 device id address start condition r/w acknowledge from one or several slave(s) a5 a4 a3 a2 a1 a0 x a6 a 1 1 1 1 0 0 1 1 device id address a i 2 c-bus slave address of the device to be identified don't care acknowledge from slave to be identified acknowledge from slave to be identified r/w m6 m5 m4 m7 m2 m1 m0 m3 a acknowledge from master c5 c4 c3 c6 c1 c0 f5 c2 a acknowledge from master manufacturer name = 00000000 p3 p2 p1 f4 p0 r2 r1 r0 revision = 000 feature identification = 010011 a p stop condition no acknowledge from master category identification = 0000001 PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 11 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 8. i/o programming 8.1 quasi-bidirectional i/o architecture the PCA9670s 8 ports (see figure 2 ) are entirely independent and can be used either as input or output ports. input data is transferred from the ports to the microcontroller in the read mode (see figure 13 ). output data is transmitted to the ports in the write mode (see figure 12 ). this quasi-bidirectional i/o can be used as an input or output without the use of a control signal for data directions. at power-on the i/os are high. in this mode only a current source (i oh ) to v dd is active. an additional strong pull-up to v dd (i trt(pu) ) allows fast rising edges into heavily loaded outputs. these devices turn on when an output is written high, and are switched off by the negative edge of scl. the i/os should be high before being used as inputs. after power-on, as all the i/os are set high, all of them can be used as inputs. any change in setting of the i/os as either inputs or outputs can be done with the write mode. remark: if a high is applied to an i/o which has been written earlier to low, a large current (i ol ) will ?ow to v ss . 8.2 writing to the port (output mode) to write, the master (microcontroller) ?rst addresses the slave device. by setting the last bit of the byte containing the slave address to logic 0 the write mode is entered. the PCA9670 acknowledges and the master sends the data byte for p7 to p0 and is acknowledged by the PCA9670. the 8-bit data is presented on the port lines after it has been acknowledged by the PCA9670. the number of data bytes that can be sent successively is not limited. the previous data is overwritten every time a data byte has been sent. fig 12. write mode (output) a5 a4 a3 a2 a1 a0 0 a sa6 slave address start condition r/w acknowledge from slave 002aac265 p6 1 p7 data 1 a acknowledge from slave 12345678 scl 9 sda a acknowledge from slave write to port data output from port t v(q) p5 data 2 data 2 valid p4 p3 p2 p1 p0 p7 p4 p3 p2 p1 p0 0 p5 p5 t v(q) data 1 valid p5 output voltage i trt(pu) i oh p5 pull-up output current PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 12 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 8.3 reading from a port (input mode) all ports programmed as input should be set to logic 1. to read, the master (microcontroller) ?rst addresses the slave device after it receives the interrupt. by setting the last bit of the byte containing the slave address to logic 1 the read mode is entered. the data bytes that follow on the sda are the values on the ports. if the data on the input port changes faster than the master can read, this data may be lost. 8.4 power-on reset when power is applied to v dd , an internal power-on reset (por) holds the PCA9670 in a reset condition until v dd has reached v por . at that point, the reset condition is released and the PCA9670 registers and i 2 c-bus/smbus state machine will initialize to their default states. thereafter v dd must be lowered below 0.2 v to reset the device. 8.5 reset input a reset can be accomplished by holding the reset pin low for a minimum of t w(rst) . the PCA9670 registers and i 2 c-bus state machine will be held in their default state until the reset input is once again high. a low-to-high transition of sda while scl is high is de?ned as the stop condition (p). transfer of data can be stopped at any moment by a stop condition. when this occurs, data present at the last acknowledge phase is valid (output mode). input data is lost. fig 13. read input port register a5 a4 a3 a2 a1 a0 1 a sa6 slave address start condition r/w acknowledge from slave 002aac266 data from port a acknowledge from master sda 1 no acknowledge from master read from port data into port data from port data 1 data 4 data 4 data 2 data 3 p stop condition t h(d) t su(d) PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 13 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 9. characteristics of the i 2 c-bus the i 2 c-bus is for 2-way, 2-line communication between different ics or modules. the two lines are a serial data line (sda) and a serial clock line (scl). both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. data transfer may be initiated only when the bus is not busy. 9.1 bit transfer one data bit is transferred during each clock pulse. the data on the sda line must remain stable during the high period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see figure 14 ). 9.1.1 start and stop conditions both data and clock lines remain high when the bus is not busy. a high-to-low transition of the data line while the clock is high is de?ned as the start condition (s). a low-to-high transition of the data line while the clock is high is de?ned as the stop condition (p) (see figure 15 .) fig 14. bit transfer mba607 data line stable; data valid change of data allowed sda scl fig 15. de?nition of start and stop conditions mba608 sda scl p stop condition sda scl s start condition PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 14 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 9.2 system con?guration a device generating a message is a transmitter'; a device receiving is the receiver'. the device that controls the message is the master' and the devices which are controlled by the master are the slaves' (see figure 16 ). 9.3 acknowledge the number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not limited. each byte of eight bits is followed by one acknowledge bit. the acknowledge bit is a high level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. a slave receiver which is addressed must generate an acknowledge after the reception of each byte. also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. the device that acknowledges has to pull down the sda line during the acknowledge clock pulse, so that the sda line is stable low during the high period of the acknowledge related clock pulse; set-up and hold times must be taken into account. a master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. in this event, the transmitter must leave the data line high to enable the master to generate a stop condition. fig 16. system con?guration 002aaa966 master transmitter/ receiver slave receiver slave transmitter/ receiver master transmitter master transmitter/ receiver sda scl i 2 c-bus multiplexer slave fig 17. acknowledgement on the i 2 c-bus 002aaa987 s start condition 9 8 2 1 clock pulse for acknowledgement not acknowledge acknowledge data output by transmitter data output by receiver scl from master PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 15 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 10. application design-in information 10.1 bidirectional i/o expander applications in the 8-bit i/o expander application shown in figure 18 , p0 and p1 are inputs, and p2 to p7 are outputs. when used in this con?guration, during a write, the input (p0 and p1) must be written as high so the external devices fully control the input ports. the desired high or low logic levels may be written to the i/os used as outputs (p2 to p7). during a read, the logic levels of the external devices driving the input ports (p0 and p1) and the previous written logic level to the output ports (p2 to p7) will be read. the gpio also has a reset line ( reset) that can be connected to an output pin of the microprocessor. since the device does not have an interrupt output, changes of the i/os can be monitored by reading the input register. if both a reset and int are needed, use the pca9671. 10.2 high current-drive load applications the gpio has a maximum sinking current of 25 ma per bit. in applications requiring additional drive, two port pins in the same octal may be connected together to sink up to 50 ma current. both bits must then always be turned on or off together. up to 8 pins (one octal) can be connected together to drive 200 ma. fig 18. bidirectional i/o expander application 002aac298 v dd temperature sensor battery status control for latch control for switch control for audio control for camera control for mp3 p0 p1 p2 p3 p4 p5 p6 p7 v dd sda scl reset ad0 ad1 ad2 core processor v dd fig 19. high current-drive load application 002aac299 v dd p0 p1 p2 p3 p4 p5 p6 p7 v dd sda scl reset ad0 ad1 ad2 core processor v dd load PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 16 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 11. limiting values [1] total package (maximum) output current is 400 ma. table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage - 0.5 +6 v i dd supply current - 100 ma i ss ground supply current - 400 ma v i input voltage v ss - 0.5 5.5 v i i input current - 20 ma i o output current [1] - 50 ma p tot total power dissipation - 400 mw p/out power dissipation per output - 100 mw t stg storage temperature - 65 +150 c t amb ambient temperature operating - 40 +85 c PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 17 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 12. static characteristics [1] the power-on reset circuit resets the i 2 c-bus logic with v dd PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 18 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 13. dynamic characteristics [1] t vd;ack = time for acknowledgement signal from scl low to sda (out) low. [2] t vd;dat = minimum time for sda data out to be valid following scl low. [3] c b = total capacitance of one bus line in pf. [4] a master device must internally provide a hold time of at least 300 ns for the sda signal (refer to the v il of the scl signal) in order to bridge the unde?ned region scls falling edge. table 6. dynamic characteristics v dd = 2.3 v to 5.5 v; v ss =0v; t amb = - 40 cto+85 c; unless otherwise speci?ed. symbol parameter conditions standard mode i 2 c-bus fast mode i 2 c-bus fast-mode plus i 2 c-bus unit min max min max min max f scl scl clock frequency 0 100 0 400 0 1000 khz t buf bus free time between a stop and start condition 4.7 - 1.3 - 0.5 - m s t hd;sta hold time (repeated) start condition 4.0 - 0.6 - 0.26 - m s t su;sta set-up time for a repeated start condition 4.7 - 0.6 - 0.26 - m s t su;sto set-up time for stop condition 4.0 - 0.6 - 0.26 - m s t hd;dat data hold time 0 - 0 - 0 - ns t vd;ack data valid acknowledge time [1] 0.3 3.45 0.1 0.9 0.05 0.45 m s t vd;dat data valid time [2] 300 - 50 - PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 19 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset [5] the maximum t f for the sda and scl bus lines is speci?ed at 300 ns. the maximum fall time for the sda output stage t f is speci?ed at 250 ns. this allows series protection resistors to be connected between the sda and the scl pins and the sda/scl bus lines witho ut exceeding the maximum speci?ed t f . [6] input ?lters on the sda and scl inputs suppress noise spikes less than 50 ns. rise and fall times refer to v il and v ih . fig 20. i 2 c-bus timing diagram scl sda t hd;sta t su;dat t hd;dat t f t buf t su;sta t low t high t vd;ack 002aab175 t su;sto protocol start condition (s) bit 7 msb (a7) bit 6 (a6) bit 0 (r/w) acknowledge (a) stop condition (p) 1 /f scl t r t vd;dat fig 21. reset timing sda scl 002aac018 t rst 50 % 30 % 50 % 50 % 50 % t rec(rst) t w(rst) reset iox_y output off start t rst ack or read cycle PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 20 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 14. package outline fig 22. package outline sot758-1 (hvqfn16) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.1 2.9 d h 1.75 1.45 y 1 3.1 2.9 1.75 1.45 e 1 1.5 e 2 1.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot758-1 mo-220 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot758-1 hvqfn16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 58 16 13 12 9 4 1 x d e c b a e 2 02-03-25 02-10-21 terminal 1 index area 1/2 e 1/2 e a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 21 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset fig 23. package outline sot162-1 (so16) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot162-1 8 16 w m b p d detail x z e 9 1 y 0.25 075e03 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a 0 5 10 mm scale so16: plastic small outline package; 16 leads; body width 7.5 mm sot162-1 99-12-27 03-02-19 PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 22 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset fig 24. package outline sot403-1 (tssop16) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 a max. 1.1 pin 1 index PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 23 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 15. handling information inputs and outputs are protected against electrostatic discharge in normal handling. however, to be completely safe you must take normal precautions appropriate to handling integrated circuits. 16. soldering 16.1 introduction to soldering surface mount packages there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 16.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow temperatures range from 215 cto260 c depending on solder paste material. the peak top-surface temperature of the packages should be kept below: moisture sensitivity precautions, as indicated on packing, must be respected at all times. 16.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. table 7. snpb eutectic process - package peak re?ow temperatures (from j-std-020c july 2004) package thickness volume mm 3 < 350 volume mm 3 3 350 < 2.5 mm 240 c+0/ - 5 c 225 c+0/ - 5 c 3 2.5 mm 225 c+0/ - 5 c 225 c+0/ - 5 c table 8. pb-free process - package peak re?ow temperatures (from j-std-020c july 2004) package thickness volume mm 3 < 350 volume mm 3 350 to 2000 volume mm 3 > 2000 < 1.6 mm 260 c + 0 c 260 c + 0 c 260 c + 0 c 1.6 mm to 2.5 mm 260 c + 0 c 250 c + 0 c 245 c + 0 c 3 2.5 mm 250 c + 0 c 245 c + 0 c 245 c + 0 c PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 24 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 16.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c. 16.5 package related soldering information table 9. suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, vfbga, xson not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 25 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages. 17. abbreviations 18. revision history table 10. abbreviations acronym description cdm charged device model cmos complementary metal oxide semiconductor esd electrostatic discharge gpio general purpose input/output hbm human body model led light emitting diode ic integrated circuit i 2 c-bus inter ic bus id identi?cation lsb least signi?cant bit mm machine model msb most signi?cant bit plc programmable logic controller raid redundant array of independent disks table 11. revision history document id release date data sheet status change notice supersedes PCA9670_1 20060620 objective data sheet - - PCA9670_1 ? koninklijke philips electronics n.v. 2006. all rights reserved. objective data sheet rev. 01 20 june 2006 26 of 27 philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset 19. legal information 19.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .semiconductors .philips .com. 19.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. philips semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local philips semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 19.3 disclaimers general information in this document is believed to be accurate and reliable. however, philips semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes philips semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use philips semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a philips semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. philips semiconductors accepts no liability for inclusion and/or use of philips semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale philips semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .semiconductors .philips .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by philips semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 19.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. i 2 c-bus logo is a trademark of koninklijke philips electronics n.v. 20. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation. philips semiconductors PCA9670 remote 8-bit i/o expander for fm+ i 2 c-bus with reset ? koninklijke philips electronics n.v. 2006. all rights reserved. for more information, please visit: http://www.semiconductors.philips.com. for sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. date of release: 20 june 2006 document identifier: PCA9670_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 device address . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.1.1 address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.2 software reset call, and device id addresses. 8 7.2.1 software reset . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.2.2 device id (PCA9670 id ?eld) . . . . . . . . . . . . . . 9 8 i/o programming . . . . . . . . . . . . . . . . . . . . . . . 11 8.1 quasi-bidirectional i/o architecture . . . . . . . . 11 8.2 writing to the port (output mode) . . . . . . . . . . 11 8.3 reading from a port (input mode) . . . . . . . . . 12 8.4 power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 12 8.5 reset input . . . . . . . . . . . . . . . . . . . . . . . . . . 12 9 characteristics of the i 2 c-bus. . . . . . . . . . . . . 13 9.1 bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 9.1.1 start and stop conditions . . . . . . . . . . . . . 13 9.2 system con?guration . . . . . . . . . . . . . . . . . . . 14 9.3 acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 14 10 application design-in information . . . . . . . . . 15 10.1 bidirectional i/o expander applications . . . . . 15 10.2 high current-drive load applications . . . . . . . . 15 11 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16 12 static characteristics. . . . . . . . . . . . . . . . . . . . 17 13 dynamic characteristics . . . . . . . . . . . . . . . . . 18 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 15 handling information. . . . . . . . . . . . . . . . . . . . 23 16 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 16.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 16.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 23 16.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23 16.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 24 16.5 package related soldering information . . . . . . 24 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 25 19 legal information. . . . . . . . . . . . . . . . . . . . . . . 26 19.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 26 19.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 19.3 disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 26 19.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 26 20 contact information . . . . . . . . . . . . . . . . . . . . 26 21 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 |
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